| ResinLab
ResinLab ofrece una línea completa de formulaciones resina para encapsulado electrónico y pegado en general. aunque, su especialidad son las formulaciones a la medida para las necesidades específicas de sus consumidores. ResinLabb tiene gran experiencia en encapsulantes con especificaciones especiales con formulaciones hechas en sus propios laboratorios. La mayoría de sus formulaciones están diseñadas y disponibles en sistemas de cartuchos para sy fácil aplicación.
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ResinLab Armstrong™ A-271B Epoxy Adhesive Hardener Part B 1 gal Pail
ResinLab Armstrong™ Epoxy Resin Adhesive A-271 Dark Amber is a two component, medium viscosity epoxy that is used to bond glass and most wood, plastics, ceramics, and metals. It offers excellent wetting abilities, low shrinkage, low exotherm, chemical and moisture resistance. Part B, 1 gal Pail. Más información -
ResinLab Armstrong™ A-701 Epoxy Adhesive Light Gray 1 qt Can
ResinLab Armstrong™ Epoxy Resin Adhesive A-701 Light Gray is a one component epoxy that is used to bond with most plastics, ceramics, and metals. It is heat curing and offers excellent electrical and chemical resistance. 1 qt Can.
Armstrong™ is a trademark of Henkel and its affiliates in the US and elsewhere, and used under license. Product manufactured under license from Henkel.
Más información -
ResinLab Armstrong™ A-706 Epoxy Adhesive Aluminum 1 pt Can
ResinLab Armstrong™ Epoxy Resin Adhesive A-706 Aluminum is a one component epoxy that contains an inert filler and resin. It offers non-sagging, heat curing, excellent machining and tensile properties. 1 pt Can.
Armstrong™ is a trademark of Henkel and its affiliates in the US and elsewhere, and used under license. Product manufactured under license from Henkel.
Más información -
ResinLab Armstrong™ A661 Epoxy Adhesive 73 g C-Kit
ResinLab Armstrong™ Epoxy Resin Adhesive A661 is a two component epoxy that is used to bond with most wood, plastics, ceramics, and metals. It cures at room temperature and has good shear strength. Part A: 48 g (1 oz) Flint Jar, Part B: 25 g (2 oz) Tube. Más información -
ResinLab Armstrong™ A661 Epoxy Adhesive Hardener Part B 1 pt Can
ResinLab Armstrong™ Epoxy Resin Adhesive A661 Dark Amber is a two component epoxy that is used to bond with most wood, plastics, ceramics, and metals. It cures at room temperature and has good shear strength. Part B, 1 pt Can.
Armstrong™ is a trademark of Henkel and its affiliates in the US and elsewhere, and used under license. Product manufactured under license from Henkel. Más información -
ResinLab Armstrong™ A661 Epoxy Adhesive Resin Part A Gray 1 pt Can
ResinLab Armstrong™ Epoxy Resin Adhesive A661 Gray is a two component epoxy that is used to bond with most wood, plastics, ceramics, and metals. It cures at room temperature and has good shear strength. Part A, 1 pt Can.
Armstrong™ is a trademark of Henkel and its affiliates in the US and elsewhere, and used under license. Product manufactured under license from Henkel. Más información -
ResinLab Armstrong™ Activator A Clear 4 oz Bottle
ResinLab Armstrong™ Activator A has a relatively short room temperature cure and low combining weight. 4 oz Bottle. Más información -
ResinLab Armstrong™ Activator E Clear 4 oz Bottle
ResinLab Armstrong™ Activator E is a low reactivity curing agent that offers long working times and elevated temperature cures. 4 oz Bottle.
Armstrong™ is a trademark of Henkel and its affiliates in the US and elsewhere, and used under license. Product manufactured under license from Henkel. Más información -
ResinLab Armstrong™ Activator H20 1 pt Can
ResinLab Armstrong™ Activator H20 is a two component, low viscosity epoxy system that cures at room temperature. 1 pt Can. Más información -
ResinLab Armstrong™ Activator W Clear 1 gal Pail
ResinLab Armstrong™ Activator W cures at room or elevated temperatures and has the ability to have a flexible or rigid bond depending on the mix ratio. You can also increase the solvent and chemical resistance by lowering the mix ratio. 1 gal Pail. Más información