Encapsulantes

Ellsworth Adhesives es el distribuidor de encapsulantes y sistemas "potting" más grande del mundo. Representamos casi todas las marcas principales y vendemos productos de todo tipo de químico. Algunos sistemas de dos partes forman parejas con resinas y catalizadores específicos. Por más información, consulte los documentos TDS.

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  1. Dow DOWSIL™ 3-8264 Silicone Encapsulant Black 210 mL Kit

    Dow DOWSIL™ 3-8264 Silicone Encapsulant Black 210 mL Kit

      

    Dow DOWSIL™ 3-8264 Encapsulant Black is a two component, self-priming silicone that is used for encapsulating electrical components that require low heat cures and primerless bonding. It is heat curing, flowable, low viscosity, and flexible. 1:1 mix ratio. 210 mL Kit. Más información
  2. Dow DOWSIL™ 93-500 Space Grade Encapsulant Clear 110 g Kit

    Dow DOWSIL™ 93-500 Space Grade Encapsulant Clear 110 g Kit

      

    Dow DOWSIL™ 93-500 Space Grade Encapsulant and 93-500 Thixotropic Space Grade Encapsulant Clear are two component, silicone elastomers that are used for aerospace applications such as sealing optical sensors, encapsulating/potting electronic components, and bonding solar cells to substrates, OSR mirrors to substrates, or cover glasses to solar cells. It offers a wide service temperature range, electrical stability, and meets NASA requirements for low thermal vacuum outgassing. 110 g Kit. Más información
  3. Dow DOWSIL™ CY 52-276 Silicone Encapsulant Part A Clear 1 kg Bottle

    Dow DOWSIL™ CY 52-276 Silicone Encapsulant Part A Clear 1 kg Bottle

      

    Dow DOWSIL™ CY 52-276 Kit Clear is a two component, low volatility silicone gel that is used for protecting and sealing electronic devices from thermal shock, vibration, fuels, and solvents. with addition cure, It offers flexibility and a low temperature cure. 1:1 mix ratio. Part A, 1 kg Bottle. Más información
  4. Dow DOWSIL™ CY 52-276 Silicone Encapsulant Part B Clear 1 kg Bottle

    Dow DOWSIL™ CY 52-276 Silicone Encapsulant Part B Clear 1 kg Bottle

      

    Dow DOWSIL™ CY 52-276 Kit Clear is a two component, low volatility silicone gel that is used for protecting and sealing electronic devices from thermal shock, vibration, fuels, and solvents. with addition cure, It offers flexibility and a low temperature cure. 1:1 mix ratio. Part B, 1 kg Bottle. Más información
  5. Dow DOWSIL™ EE-1010 Low Viscosity Encapsulant 36.2 kg Kit

    Dow DOWSIL™ EE-1010 Low Viscosity Encapsulant 36.2 kg Kit

      

    Dow DOWSIL™ EE-1010 Low Viscosity Encapsulant is a two component, 1:1 mix ratio silicone elastomer for the electronics industry. Benefits include a room temperature cure that can be accelerated with heat, and a long working time. Part A and Part B are different colors for easy identification when mixing. EE-1010 can be dispensed through meter mixing or manually. 36.2 kg Kit. Más información
  6. Dow DOWSIL™ EE-3200 Silicone Encapsulant Part A Off-White 0.5 kg Jar

    Dow DOWSIL™ EE-3200 Silicone Encapsulant Part A Off-White 0.5 kg Jar

      

    Dow DOWSIL™ EE-3200 Low Stress Silicone Encapsulant is a two component, low viscosity encapsulant with a 1:1 mix ratio, good heat dissipation, and good thermal conductivity. Once thoroughly mixed, the mixture will cure to a flexible elastomer for the protection of electronic and electrical components. Part A, 0.5 kg Jar. Más información
  7. Dow DOWSIL™ EE-3200 Silicone Encapsulant Part B Black 0.5 kg Jar

    Dow DOWSIL™ EE-3200 Silicone Encapsulant Part B Black 0.5 kg Jar

      

    Dow DOWSIL™ EE-3200 Low Stress Silicone Encapsulant is a two component, low viscosity encapsulant with a 1:1 mix ratio, good heat dissipation, and good thermal conductivity. Once thoroughly mixed, the mixture will cure to a flexible elastomer for the protection of electronic and electrical components. Part B, 0.5 kg Jar. Más información
  8. Dow DOWSIL™ EG-3810 Dielectric Gel Encapsulant Clear 18 kg Pail

    Dow DOWSIL™ EG-3810 Dielectric Gel Encapsulant Clear 18 kg Pail

      

    Dow DOWSIL™ EG-3810 Dielectric Gel is a one component, clear, heat curing silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers a wide range of operating temperatures ranging from -60 °C to 200 °C, low viscosity, and no mixing needed. 18 kg Pail. Más información
  9. Dow DOWSIL™ EG-3896 Dielectric Gel Encapsulant Clear 36 kg Kit

    Dow DOWSIL™ EG-3896 Dielectric Gel Encapsulant Clear 36 kg Kit

      

    Dow DOWSIL™ EG-3896 Dielectric Gel is a two component, somewhat hazy to clear, fast heat curing silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers flowability, resistance to crack formation, and cures to a soft material. 1:1 mix ratio. 36 kg Kit. Más información
  10. Dow DOWSIL™ EI-1184 Optical Encapsulant Clear 1 kg Kit

    Dow DOWSIL™ EI-1184 Optical Encapsulant Clear 1 kg Kit

      

    Dow DOWSIL™ EI-1184 Optical Encapsulant is a two component, silicone that is used for encapsulating circuit boards, electrical and LED Lighting applications. It offers high transparency and rapid, heat and room temperature cure. 1:1 mix ratio. 1 kg Kit. Más información

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