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EG-3810 DIELECTRIC GEL 18KG PAIL

Dow DOWSIL™ EG-3810 Dielectric Gel Encapsulant Clear 18 kg Pail

 
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Descripción

Dow DOWSIL™ EG-3810 Dielectric Gel is a one component, clear, heat curing silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers a wide range of operating temperatures ranging from -60 °C to 200 °C, low viscosity, and no mixing needed. 18 kg Pail.

Dow DOWSIL™ EG-3810 Dielectric Gel Encapsulant Clear 18 kg Pail

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Número de Pieza EG-3810 DIELECTRIC GEL 18KG PAIL
Fabricante Número de Pieza 4116483
Color Clear
Componentes 1 part
Fuerza Dieléctrica 533 V/mil
Punto de Inflamación >100 °C
Tiempo de Curado Completo 15min @ 125 °C; 10min @ 150 °C
Gravedad Específica 0.97
Viscosidad CP 690
Resistencia del Volúmen 2e + 15 ohm-cm
Used for protecting and potting of electronics, and power semiconductor modules to protect interconnects and dies from outside conditions.